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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages,0792384857,9780792384854

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Book Information

Publisher:Springer
Published In:30-Apr-1999
ISBN-10:0792384857
ISBN-13:9780792384854
Binding Type:Hardback
Weight:468 gms
Pages:pp. 164, 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss L

The Title "The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1st Edition" is written by Gerard Kelly. This book was published in the year 1999. The ISBN number 0792384857|9780792384854 is assigned to the Hardback version of this title. This book has total of pp. 160 (Pages). The publisher of this title is Springer. We have about 203362 other great books from this publisher. The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1st Edition is currently Available with us.

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