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Hybrid Assemblies and Multichip Modules

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Hybrid Assemblies and Multichip Modules,0824784669,9780824784669

Hardback

£ 141.00

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Book Information

Publisher:Taylor & Francis Group
Published In:01-Jan-1992
ISBN-10:0824784669
ISBN-13:9780824784669
Binding Type:Hardback
Weight:715 gms
Pages:pp. 296, 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss L

The Title "Hybrid Assemblies and Multichip Modules 1st Edition" is written by Fred W. Kear. This book was published in the year 1992. The ISBN number 0824784669|9780824784669 is assigned to the Hardback version of this title. This book has total of pp. 296 (Pages). The publisher of this title is Taylor & Francis Group. We have about 143699 other great books from this publisher.

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