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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines A Focus on Reliability

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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines A Focus on Reliability,0471594466,9780471594468

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Book Information

Publisher:John Wiley & Sons
Published In:1994
ISBN-10:0471594466
ISBN-13:9780471594468
Binding Type:Hardback
Weight:939 gms
Pages:pp. 426

is written by Michael Pecht. The publisher of this title is John Wiley & Sons.

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