Hybrid Assemblies and Multichip Modules
by Fred W. Kear
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| Publisher: | Taylor & Francis Group |
| Published In: | 01-Jan-1992 |
| ISBN-10: | 0824784669 |
| ISBN-13: | 9780824784669 |
| Binding Type: | Hardback |
| Weight: | 715 gms |
| Pages: | pp. 296, 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss L |
The Title "Hybrid Assemblies and Multichip Modules 1st Edition" is written by Fred W. Kear. This book was published in the year 1992. The ISBN number 0824784669|9780824784669 is assigned to the Hardback version of this title. This book has total of pp. 296 (Pages). The publisher of this title is Taylor & Francis Group. We have about 143699 other great books from this publisher.