The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
by Gerard Kelly
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| Publisher: | Springer |
| Published In: | 30-Apr-1999 |
| ISBN-10: | 0792384857 |
| ISBN-13: | 9780792384854 |
| Binding Type: | Hardback |
| Weight: | 468 gms |
| Pages: | pp. 164, 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss L |
The Title "The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1st Edition" is written by Gerard Kelly. This book was published in the year 1999. The ISBN number 0792384857|9780792384854 is assigned to the Hardback version of this title. This book has total of pp. 160 (Pages). The publisher of this title is Springer. We have about 203362 other great books from this publisher. The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1st Edition is currently Available with us.