Investigation of hygroscopic swelling behavior of molding compound and its impact on encapsulated MEMS packages.
by Haojun Zhang
| Publisher: | Unknows |
| Published In: | 17-Jul-2012 |
| ISBN-10: | 1249048699 |
| ISBN-13: | 9781249048695 |
| Binding Type: | Paperback |
| Weight: | 354 gms |
| Pages: | pp. 140 |
The Title "Investigation of hygroscopic swelling behavior of molding compound and its impact on encapsulated MEMS packages." is written by Haojun Zhang. This book was published in the year 1720. The ISBN number 1249048699|9781249048695 is assigned to the Paperback version of this title. This book has total of pp. 140 (Pages). The publisher of this title is Unknows. Investigation of hygroscopic swelling behavior of molding compound and its impact on encapsulated MEMS packages. is currently Not Available with us.You can enquire about this book and we will let you know the availability.